External Source

Enabling Moore’s Law’s Next Frontier Through Heterogeneous Integration – Dr. Raja Swaminathan, Amd

2022 29:16
Synopsis
Dr. Swaminathan, in his talk, focuses on 3D chiplet technology and advanced packaging innovations by AMD. The chiplets are ...

You Might Also Like

Heterogeneous Integration Roadmap 13:25
Heterogeneous Integration Roadmap
2021
Design Integration: Systematic Identification of Key Design Factors for Chiplet Eco System Enabling 35:19
Design Integration: Systematic Identification Of Key Design ...
2022
Stacking chips using 3D heterogeneous integration 0:40
Stacking Chips Using 3d Heterogeneous Integration
2016
2007-12-26: Moore's Law: still working after all these years 0:57
2007-12-26: Moore's Law: Still Working After All These Years
2012
Moore's Law 1:28
Moore's Law
2015
LETs Talk - Moore's Law and The Secret World Of Ones And Zeroes 2:06
Lets Talk - Moore's Law And The Secret World Of Ones And Zer...
2015
Challenges For Heterogeneous Integration 20:32
Challenges For Heterogeneous Integration
2023
Tutorial 2: Heterogenous Integration (HI) using advanced packaging 1:29:29
Tutorial 2: Heterogenous Integration (hi) Using Advanced Pac...
2022
Advanced Packaging 1-3 #AMD 26:00
Advanced Packaging 1-3 #amd
2022
AMD Packaging - Heterogeneous Integration & Advanced Technologies #shorts #podcast #amd #ai #tech 0:53
Amd Packaging - Heterogeneous Integration & Advanced Technol...
2025
IEEE Heterogeneous Integration Roadmap: HIR 2020 Retrospective 32:35
Ieee Heterogeneous Integration Roadmap: Hir 2020 Retrospecti...
2021
Download Options
Choose a download method below. All links open in new tabs.
Service Features Action
SaveFrom
MP4 & MP3 • HD Quality • Browser Extension Available
Download
Security Notice: These are third-party services. We recommend using antivirus software and being cautious of pop-up ads.